3 January 2025 · 2 min read
The European Commission has approved €1.3 billion in state aid to support the establishment of the Silicon Box facility in Novara, Italy. With a total investment of €3.2 billion, this groundbreaking project will create Europe’s first advanced packaging and chiplet integration facility. The new factory will handle assembly, packaging, and testing while leveraging state-of-the-art solutions and technologies for advanced semiconductor packaging.
The funding will be provided as a direct grant to Silicon Box, contingent on the project's alignment with the European Chips Act and its role in strengthening the EU’s semiconductor ecosystem. This initiative supports the EU's strategic objective of producing 20% of the world’s semiconductors by 2030, enhancing Europe’s technological sovereignty.
Key Features of the Facility
The advanced manufacturing plant will include:
- Panel-Level Packaging and Heterogeneous Integration: Cutting-edge technologies for semiconductor assembly.
- R&D Center: A hub dedicated to next-generation packaging solutions.
- Industry 4.0 Automation: Fully automated systems for efficient and precise manufacturing.
- Sustainability Focus: Net-zero technologies to minimize carbon footprint and environmental impact.
A Call for Semiconductor Talent
The Silicon Box facility is projected to create 1,600 high-skilled jobs, reflecting its reliance on cutting-edge technologies and its significant operational scope. To address the talent needs for this ambitious project, dedicated training programs will be launched to expand the regional workforce’s qualifications and support sustainable workforce development.
As the semiconductor industry faces a growing talent shortage and skills gap, strategic action is essential. In this context, the Industrial Alliance on Processors and Semiconductor Technologies, initiated by the European Commission, is playing a pivotal role. A dedicated Working Group on Skills within the Alliance has been actively collaborating with industry leaders to address these challenges.
The Working Group's efforts culminated in the release of the Blueprint on Skills Gap in June 2024. This comprehensive document outlines actionable recommendations to bridge the skills gap, including leveraging existing training initiatives, fostering cross-sector collaboration, and promoting education programs aligned with industry demands. These measures aim to ensure a robust talent pipeline that meets the evolving needs of Europe’s semiconductor ecosystem.
Timeline for Development
It is envisaged that the construction will start in the latter half of 2025, with initial production scheduled for 2028. The facility is projected to reach full operational capacity by 2033, processing approximately 10,000 panels weekly.
Boosting Europe’s Semiconductor Industry
By fostering technological advancements and innovation, the European Commission’s investment aims to solidify Europe’s position in the global semiconductor supply chain. Previously, state aid was granted for the construction of facilities in Sicily(Italy), Crolles (France), Dresden (Germany). This latest investment in the Silicon Box facility in Italy represents a pivotal step in achieving a robust and sustainable semiconductor industry within the EU.
