Objective

Pillar III of the European Chips Act establishes a coordination mechanism between the Member States and the Commission to strengthen collaboration on monitoring and crisis response. The governance mechanism of the European Chips Act is ensured by the European Semiconductor Board (ESB), which includes representatives of the Member States and is chaired by the Commission. To implement the monitoring, as well as to inform other policy initiatives of the Commission, it is crucial to increase the semiconductor supply chain transparency. This will in turn inform other future Commission initiatives with a view to increasing supply chain resilience

The Working Group (WG) on Supply Chains shall:

• Support the Commission and the ESB in its monitoring and mapping efforts, with a joint commitment of all the WG’s participants to share relevant knowledge and expertise in a timely manner.
• Support the Commission’s efforts to increase supply chain transparency and resilience by providing relevant supply chain analysis as inputs to other Commission initiatives.
• provide advice to the Commission on possible future policy actions in this area.

Any company active in the European semiconductor value chain would be eligible to participate. Ideally there should be representation of all the segments of the value chain, as well as end users companies/industry associations from different economic sectors, including the critical sectors provided for in the Chips Act. Industry associations are also eligible. The participants are expected to substantially contribute to the different deliverables, thus members’ profiles should have the capacity and expertise to contribute (e.g. supply chain managers/strategists etc).