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Internal event

The Technology Sovereignty Package in Practice

The Technology Sovereignty Package in Practice: The EU's Semiconductor Angle
Geoffrey Lee

Geoffrey Lee

Vice President at Siemens EDA

Geoff Lee is Vice President of EMEA Sales at Siemens EDA, a role he has held since 2024. He joined Mentor Graphics, now part of Siemens, in 1999 and helped launch the Calibre product line. He later held senior account roles across Europe before leading Strategic Accounts worldwide.

Sessions

Theatre - Main stage Keynote

15:00–16:00

European Chip Design Platform launch with the presence of EVP Virkkunen

Speaker
EVP Henna Virkkunen

Henna Virkkunen

Executive VP European Commission
Jari Kinaret

Jari Kinaret

Executive Director at Chips JU
Patrick Vandenameele

Patrick Vandenameele

CEO, imec
Romano Hoofman

Romano Hoofman

Strategic Development Director at imec & EuroCDP Coordinator
Paul Williamson

Paul Williamson

Senior Vice President at ARM
Joe Cole

Joe Cole

Corporate Vice President at Cadence
Geoffrey Lee

Geoffrey Lee

Vice President at Siemens EDA
Antonio Varas

Antonio Varas

Chief Strategy Officer at Synopsys
Moderator
Silvana Muscella

Silvana Muscella

CEO of Trust-IT, ALLPROS.eu Technical Coordinator

Join us at The Technology Sovereignty Package in Practice

4 Nov 2026 – 5 Nov 2026