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Internal event

The Technology Sovereignty Package in Practice

The Technology Sovereignty Package in Practice: The EU's Semiconductor Angle
Pierre Chastanet

Pierre Chastanet

Head of Unit - Microelectronics and Photonics at the European Commission

Pierre Chastanet is a Head of Unit at DG CNECT responsible for Microelectronics & Photonics, leading implementation of the EU Chips Act. He previously led cloud, software, and cybersecurity policy at EU level, including industrial data strategy and cloud infrastructure initiatives. A core policy builder across Europe’s semiconductor, cloud, and digital infrastructure stack.

Sessions

Theatre - Main stage Panel

14:10–14:45

Panel “Boosting Chip Design in Europe"

Speaker
Antonio Varas

Antonio Varas

Chief Strategy Officer at Synopsys
Joe Cole

Joe Cole

Cadence, Corporate Vice President
Paul Wiliamson

Paul Williamson

SVP, Corporate Ventures - Arm
Geoffrey Lee

Geoffrey Lee

Siemens EDA, Vice President
Gunnar Thomas

Gunnar Thomas

TSMC Europe, General Counsel
Moderator
Pierre Chastanet

Pierre Chastanet

Head of Unit - Microelectronics and Photonics at the European Commission

Join us at The Technology Sovereignty Package in Practice

4 Nov 2026 – 5 Nov 2026